Baugh & Weedon BondCheck Multi-Mode Bond Testing Flaw Detector

Tech Support
(800) 404-2832

With Every
Rental

Worldwide
Delivery

Larger

Categories

Bond Testers

Documents

Datasheet

The Baugh & Weedon BondCheck is a multi-mode bond testing flaw detector. This detector provides high-speed inspection in pitch-catch, resonance, and MIA bond testing modes -- with excellent defect sensitivity. All functions are housed in within the Baugh & Weedon BondCheck with a common user interface between the three modes. This design provides a simple and intuitive operator led set-up. The Baugh & Weedon BondCheck multi-mode bond tester is a valuable tool for inspection in the laboratory, under cover, or out in the field.

This bond testing flaw detector has a large 14.5 cm (5.7 inches) LCD color screen of 640 x 480 pixels -- providing the operator with excellent signal resolution and presentation. Additionally, the user may choose a configuring of their own color schemes and display types.

Specifications
Features
Applications
Options
Accessories
Standards
Videos

Operating frequencies	30 kHz (suitable for 10 kHz to 50 kHz operation)
Transmit - receive probe separation	17 mm
Transmit - receive probe linear travel	> 5 mm
Probe auto-recognition	Yes
Probe alarm LED	Yes
Probe feet	Multiple positions, user changeable.
Probe tips	Rounded end and flat end, replaceable by user
Probe materials	Anodised aluminium case, with stainless steel probe housings, rubber finger grip.
Probe connector	LEMO:ECG.1B.308.CLV

Baugh & Weedon BondCheck Multi-Mode Bond Testing Flaw Detector

RELATED PRODUCTS