- environmental simulation
- chambers
- thermal shock
Thermal Shock Chambers
A thermal shock chamber, a specialty type of chamber that is actually two chambers stacked on top of one another, exposes a device under test (DUT) to an alternating series of extreme temperatures. Testing in these chambers help expose design flaws from sudden hot and cold temperature changes by alternating between heat up to 210°C and cold down to -75°C. A carrier moves between the 2 chambers, exposing the DUT to extreme temperatures and potentially causing swells and contractions.
To meet various test standards, a product needs exposure to sudden changes in the environment. These are some of the common testing standards:
To meet various test standards, a product needs exposure to sudden changes in the environment. These are some of the common testing standards:
- MIL-STD-202 Method 107
- MIL-STD-810 Method 503
- MIL-STD-883 Method 1010
- JESD22-A104D